As the semiconductor market has progressed, control of device power dissipation, and resulting device temperatures, has been the root cause in lower production burn-in yields and device throughput. With the advent of finer IC architecture, demand for higher power devices, and more complex ICs, power dissipation variations can vary 10W or more from devices made on the same wafer. This power dissipation variation causes difficulties in controlling device performance during production burn-in and test environments. Burn-in engineers need more intelligent, and lower cost, methods of monitoring and controlling device temperatures in order to maintain maximum yield and throughput.
To solve this problem Antares has developed and introduced a method to make sockets intelligent with iSocket™ Thermal Management Technology. iSocket™ is a customized thermal management assembly (TMA), designed to meet or exceed JEDEC burn-in or test characterization requirements. iSocket™ technology is a low cost alternative to high cost burn-in chambers designed to control these thermal discrepancies.
About iSocket™
The iSocket™ TMA interfaces with individual device and socket assemblies on the printed circuit board. An integral microprocessor calculates the precise amount of heat, or cooling, required to maintain the device at a programmed temperature.
The user can program the desired temperature to individual iSockets™ through iSocket Host, a graphical user interface.
Device temperatures can also be monitored via the bus. The iSocket™ TMA is custom designed and can be configured to accommodate most other manufacturer's sockets. iSocket™ is also offered in various configurations:
Benefits of iSocket™
