| Burn-in Sockets | |
| High Performance Test Sockets | |
| Thermal Solutions | |
| High Performance Boards | |
| Spring Probes | |
| Technology Advancements | |
| Change Kits/Stiffeners | |
| Docking Systems/Manipulators | |
| Receptacles |
| Spring Probes |
Mechanical pin tip design can be varied at each end of the contact to provide the best socket-to-package and socket-to-PCB interconnection.
Tips can also be designed for specific applications to optimize contact surface area while minimizing contact wear factors, as well as lead and solder ball deformation.
Elements can be scaled and materials chosen to produce a contact that optimizes performance for high-speed signals, or for high or low power requirements. Scaling also allows the design and production of contact pins to meet high pin-count and tight pitch requirements.