| Burn-in Sockets | |
| High Performance Test Sockets | |
| Thermal Solutions | |
| High Performance Boards | |
| Technology Advancements | |
| Change Kits | |
| Docking Systems/Manipulators | |
| Receptacles |
| PCB Materials A DCI Product |
|
Material
|
Composition
|
Dk @ 1GHz
|
Dk @ 10 GHz
|
Loss @ 1 GHz
|
Loss @ 10 GHz
|
Tg (*C)
|
Process
|
More Info
|
|
FR4
|
Resin/Glass
|
4.50
|
-
|
0.0270
|
-
|
140
|
OK
|
-
|
|
FR408
|
Resin/Glass
|
3.70
|
-
|
0.0100
|
-
|
180
|
OK
|
-
|
|
GETEK
|
Resin/Glass
|
3.6-4.1
|
-
|
0.0130
|
-
|
180
|
OK
|
|
|
N4000-13 SI
|
Resin/Glass
|
3.60
|
3.50
|
0.0080
|
0.0060
|
210
|
OK
|
|
|
N6000-SI
|
Resin/Glass
|
3.40
|
3.00
|
0.0030
|
0.0060
|
210
|
OK
|
|
|
R04003
|
Plastic/Ceramic/Glass
|
-
|
3.38
|
-
|
0.0022
|
280
|
OK
|
|
|
R04350
|
Plastic/Ceramic/Glass
|
-
|
3.48
|
-
|
0.0040
|
280
|
OK
|
|
|
R03003
|
PTFE/Ceramic
|
-
|
3.00
|
-
|
0.0013
|
NA
|
Hybrid
Only |
Source: DCI
* RO3003 manufacturing process requires hybrid approach due to brittle nature of material.
| Mixed Signal ATE Board | |
| Application/Bench Board | |
| Blank Probe Cards | |
| Specialty Boards | |
| Digital ATE Boards | |
| Mechanical Fixturing/ Board Stiffeners |
|