Burn-in Sockets
	High Performance Test Sockets
	Thermal Solutions
	High Performance Boards
	Technology Advancements
	Change Kits
	Docking Systems/Manipulators
	Receptacles

---

Sockets and Contactors for QFP, SOP, SOIC, and Other Leaded Devices

Because the structural integrity and dimensional stability of package types vary, and because lead frame packages are produced in a wide range of shapes and sizes, each type must be handled differently. Antares' knowledgeable and experienced engineering staff are able to take these nuances into account and, in conjunction with the most advanced test application and handling methodology, ensure accurate and repeatable test results.

CSP Test Sockets
BGA/LGA Test Sockets
QFN/MLF Test Sockets
QFP, SOP, SOIC and other Leaded Devices
Lids
Strip Test Contactors
C Res Tester